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Qualification is done to validate the initial component capability to meet the critical specification requirements; while Group C Testing is done to validate a given component manufactured lot meets the critical specification requirements.

EM stands for Engineering Models. Engineering Models are shipped with a C of C only. 

A slow blow fuse is different from a fast acting fuse in its capability to withstand transient pulse currents, i.e., it can withstand the surge current upon power-on/off, thus ensuring the equipment works normally. Therefore, slow blow fuses are often called time-delay fuses. Technically, a slow blow fuse features a higher I2t value, and it requires more energy to blow, so it is more capable of withstanding pulses compared with a fast acting fuse of same rated current.

Per MIL-PRF-23419/12F here is the list and table of the group B testing. 

Group C inspection: Group C inspection shall be in accordance with MIL-PRF-23419, except 16 samples shall be subjected to the subgroup I inspections as specified in table V. Maximum clearing I2t for subgroups II and IV shall be performed at 600 percent of the +25°C rated current.

The "H" designation signifies that a high temperature solder has been used in the manufacture of the fuse.

Submit a request for information through the AEM website.

We create STEP files at the customer request, if you would like a STEP file, please email hrcsales@aem-usa.com and we will make a STEP file for you as soon as possible.

Submit a request for information through the AEM website or email hrcsales@aem-usa.com. 

"-US" parts are up-screened parts. 

Finished HRB-US products are up-screened to DSCC 03024 specifications.

AEM’s Tin Whisker Mitigation (TWM) process is done by adding lead (Pb) to components with pure tin (Sn) terminals. Our Sn-Pb conversion process involves both Sn-Pb plating and subsequent fusion processing to ensure that the resultant component terminations are a homogenous mixture of Sn-Pb. The AEM Sn-Pb conversion process is NOT a hot solder dip operation that introduces the risk of thermal shock to the components.

The majority of parts ran (~70%) are passive ferrite chip, capacitors , inductors, resistors. Also able to do active components like diodes and Mosfets